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Semiconductor Etching Agents

Daikin provides etching agents for wet and dry fluorine types for semiconductor manufacturing. For wet etching agents, we provide high quality products in which impurities such as metal-ions, etc., are minimized. We also handle grades with improved permeability and reduced particle adhesion onto wafers by adding a unique surfactant.

Grades and Features of Etching Agents

Type	Grades	Features
Wet Etching agent	Aqueous Hydrofluoric Acid (HF) (50%、49%)	High Quality (Low containing of metal, impurity)
	Ammonium FLuoride (NH4F) (40%)	High Quality (Low containing of metal, impurity)
	Buffered Hydrogen Fluoride(BHF)	High Quality (Low containing of metal, impurity)
	Buffered Hydrogen Fluoride with Surface-active Agent (BHF-U)	Improved permeability, reduced particle adhesion
	Zielex Buffered Hydrogen Fluoride (Zielex BHF)	Suppressed etching rate change (versus conventional product) Other characteristics are the same as Buffered Hydrogen Fluoride with surfactant
Dry Etching agent	PFC-14(CF4)	High-Purity (More than 99.999 %)
	PFC-116(C2F6)
	PFC-C318(C4F8)
	HFC-23(CHF3)
	HFC-32(CH2F2)

* Aqueous Hydrofluoric Acid (HF) mentioned in this page comes under the goods to be controlled by the Foreign Exchange and Foreign Trade Law of Japan.