Etching Agent
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Semiconductor Etching Agents

Daikin provides etching agents for wet and dry fluorine types for semiconductor manufacturing. For wet etching agents, we provide high quality products in which impurities such as metal-ions, etc., are minimized. We also handle grades with improved permeability and reduced particle adhesion onto wafers by adding a unique surfactant.

Grades and Features of Etching Agents

Type Grades Features Technical data sheet
Wet Etching agent Aqueous Hydrofluoric Acid (HF)
(50%、49%)
High Quality (Low containing of metal, impurity) Technical data sheet
Ammonium FLuoride (NH4F)
(40%)
High Quality (Low containing of metal, impurity) Technical data sheet
Buffered Hydrogen Fluoride(BHF) High Quality (Low containing of metal, impurity) Technical data sheet
Buffered Hydrogen Fluoride with Surface-active Agent (BHF-U) Improved permeability, reduced particle adhesion Technical data sheet
Zielex Buffered Hydrogen Fluoride (Zielex BHF) Suppressed etching rate change (versus conventional product)
Other characteristics are the same as Buffered Hydrogen Fluoride with surfactant
Technical data sheet
Dry Etching agent PFC-14(CF4) High-Purity (More than 99.999 %) Technical data sheet
PFC-116(C2F6) Technical data sheet
PFC-C318(C4F8) Technical data sheet
HFC-23(CHF3) Technical data sheet
HFC-32(CH2F2) Technical data sheet

*  Aqueous Hydrofluoric Acid (HF) mentioned in this page comes under the goods to be controlled by the Foreign Exchange and Foreign Trade Law of Japan.

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